Ultra-Broadband 
Communication
Platforms Laboratory

日本語

TO STUDENTS

What Is Ultra-Broadband Communication Platforms Lab?

Our laboratory engages in research aimed at creation of sub-terahertz/terahertz semiconductor devices and optical-wireless-convergence devices based on novel physics, principles, and materials for realization of next-generation information communication systems.

For more detailed research contents, please see here.

Research keyword: Beyond 5G, terahertz, optical-wireless convergence, semiconductor, nanotechnology, plasmon, graphene

Features of Our Lab

  • In-house device fabrication by utilizing semiconductor fabrication equipment in the clean room of Nano-Spin Building.
  • A broad range of research from elucidating device physics to improving device performance for communication applications.
  • International collaborative research and exchanges.

Who Are Suitable for Our Lab?

  • People who are good at or enjoy making things
  • People who want to deeply explore a single theme
  • People interested in semiconductor device physics, manufacturing, and design
  • People interested in high-speed communication and high-frequency measurement

Research Achievements by Students

Many experiences of conference presentations and awards.
Recent awards received are as follows:

  • International Conference IGROW Best Poster Award (MC2 student, 2024)
  • International Conference IRMMW-THz Best Poster Award (MC2 student, 2022)
  • FY2022 Dean’s Award, Graduate School of Engineering, Tohoku University (M2 student)

For more details, click here.

Related Academic Subjects

Solid State Physics, Semiconductor Devices, Electromagnetics
*not compulsory

Employment Destinations of Graduates

  • Measuring equipment:Anritsu, Keysight, KEYENCE
  • Semiconductor manufacturing equipment: Tokyo Electron, Tokyo Electron Miyagi, DISCO
  • Semiconductor devices: Sumitomo Electric Industries, Kioxia, Hamamatsu Photonics, Sony Semiconductor Solution, Sony Semiconductor Manufacturing
  • Electronic components: Murata Manufacturing, Alps Alpine
  • Electrical/Electronic: Sony, Hitachi, Cannon, Ricoh
  • Communication: NTT docomo
  • Car: Mitsubishi, Honda, BRIDGESTONE
  • Electric Power: Tohoku Electric Power, Chubu Electric Power
  • Government official: Japan Patent Office

* Including alumni from former ultra-broadband signal processing lab.